Abstract
The application of plasma treatment for fluxless soldering is known in the field of wave soldering. Plasma treatment of printed circuit boards (PCBs) with solid solder deposits (SSDs) makes it possible to eliminate the application of conventional flux in reflow soldering process. However, the main problem is the need of storing PCBs between plasma treatment and reflow soldering without reoxidation of surfaces. Therefore it is necessary to fund ways to realize the known plasma soldering process with formation of protective film on the top of the SSDs during the plasma treatment. This work deals with the dependence of surface modification of eutectic SnPb solder materials on process parameters. After plasma treatment is detected both metal fluoride and polymer formation. The reflow soldering influences the amount of polymer layers on the solder surface.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
