Plasma Surface Modification of Poly(aryl ether ether ketone) and Surface Metallization using Copper Metal

Abstract

The surface of poly(aryl ether ether ketone) (PEEK) was modified using oxygen plasma treatment to improve the adhesive strength at Cu/PEEK interfaces. It is well known that plasma treatment results in etching and introduces functional groups to polymer surfaces. The effect of plasma treatment methods, which were ordinary plasma treatment and pulsed plasma treatment, on the adhesive strength was evaluated. The following three points were revealed; (1) oxygen plasma treatment enhanced the adhesive strength at Cu/PEEK interfaces; (2) oxygen plasma treatment introduced oxygen functional groups and produced an etching action at the interfaces. This etching action certainly contributed to the adhesive strength among these actions; (3) introduction of oxygen functional groups might also produce a synergetic effect with an etching action and this might result in stronger adhesion.