Plasma processing for integrated circuits

Abstract

The steady advance of integrated circuit technology is one of the most remarkable technology trends in this era of technological revolution. For example, the 64-k memory chips of the early 1980s are now being replaced by 4-M and even 16-M chips. This trend is expected to continue with chips at the giga-bit level being available in a decade. The needs for ultraviolet and then X-ray lithography to define the submicron features needed for these larger, denser chips have been widely discussed. However, in parallel, the equipment (referred to as tools in the industry) and related processes to carry out the deposition and etching steps needed to actually produce devices in the tenth-micron range also require significant development. This paper summarizes present and anticipated contributions of magnetic fusion plasma theory and diagnostics and plasma production technology at Oak Ridge National Laboratory (ORNL) for the development of integrated circuit production technology. The discussion is introduced with a review of past technology evolution and of the present economic context for manufacturing.