Abstract
Packaging using thermoplastic molding for hollowed GaN chips were requested for a leak-proof micro-joining between plastic molds and copper-based substrates. The design and engineering of micro-textures is a key technology for putting leak-proof packaging into practice. In the present paper, a micro-meshing punch array was prepared using plasma-nitriding-assisted printing. Two-dimensional original patterns were screen-printed onto an AISI316 die substrate and plasma nitrided at 673 K for 14.4 ks (or 4 h). The unprinted surfaces were selectively nitrogen super-saturated to have more nitrogen content than 5 mass% and a higher hardness than 1200 HV. The printed surfaces were selectively sand blasted to fabricate the micro-meshing punch array for micro-embossing. A computer numerically controlled stamping system was utilized to describe the micro-embossing behavior onto copper substrates and to investigate how the micro-textures on the array was transcribed onto the copper. Reduction of takt time as well as flexibility in the micro-grooving were discussed with reference to the picosecond laser machining and mechanical milling processes.
Highlights
Welding and chemical adhesion processes have been utilized as a reliable means for joining of metallic components and parts
Mechanical micro-joining is needed to make innovative packaging for power transistors and computer-processing units [3]. In those micro-joining processes, the surface to be joined must have micro-textures to increase the joining strength between two dissimilar parts, e.g., a plastic mold which must be micro-joined to a metallic substrate [4]
How to make suitable micro-textures into metallic substrates has become an urgent issue in engineering these packaging processes
Summary
Welding and chemical adhesion processes have been utilized as a reliable means for joining of metallic components and parts. Mechanical micro-joining is needed to make innovative packaging for power transistors and computer-processing units [3]. In those micro-joining processes, the surface to be joined must have micro-textures to increase the joining strength between two dissimilar parts, e.g., a plastic mold which must be micro-joined to a metallic substrate [4]. There has been many micro-texturing methods reported, e.g., the micro-milling method [5], the micro-EDM (electrical discharging machining) method [6], and the laser micro-texturing method [7] In the former two approaches, their micro-texturing process into a die substrate is very much dependent on the durability of thin tools and wires during the long cutting time. The authors [8] proposed a non-traditional method to accommodate
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