Abstract
Optical emission represents the bulk property of plasma, which in turn can be correlated to the chamber surface condition and can be exploited for monitoring and characterizing chamber condition. This presentation demonstrates the approach of utilizing plasma optical emission spectra (OES) for the application on Applied Materials' Tetra TM etcher chamber condition monitor. Time-resolved plasma optical emission spectra are collected with a spectrometry unit built in to the TetraTM photomask etch module. Studies on OES analysis show that information related to chamber surface condition can be correlated to the changes in emission spectrum of plasma. The effectiveness of this methodology can be verified by Cr etch rates. Results can lead to procedure development for chamber monitoring, chamber recovery and chamber seasoning applications.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
