Plasma Etch of IGZO Thin Film and IGZO/SiO2 Interface Diffusion in Inductively Coupled CH4/Ar Plasmas

Abstract

ABSTRACTIn this work, the etching characteristics of InGaZnO4 (IGZO) thin films were systemically investigated in inductively coupled CH4/Ar plasmas with various gas ratios, bias voltages, and surface temperatures. The ion flux in the CH4/Ar plasmas was analyzed using bias power and voltage, whereas the relative densities of CH and H radicals were quantified through optical actinometry. The change in CH3 radical density was also estimated based on plasma kinetics analysis. The correlations between the plasma properties and IGZO etch rate were investigated. In CH4/Ar plasmas with CH4 ratios below 80%, the IGZO etch rate increases with a higher CH4 proportion, aligning with the ascending trend of CH3 radical density, which suggests that CH3 radical density acts as a limiting factor (radical‐limited regime). However, the IGZO etch rate decreases when the CH4 ratio exceeds 80%, corresponding to the reduction in ion flux, which indicates that ion flux becomes a limiting factor in this ion‐limited regime. The IGZO etch rate shows a linear relationship with bias voltage and follows the Arrhenius equation with varying surface temperature in plasmas without bias voltage. A spontaneous etch model was proposed based on these relationships. In this model, the IGZO etch rate depends on CH3 radical density and IGZO surface reactivity, where ion bombardment contributes more significantly to surface reactivity than high surface temperature. IGZO thin film was deposited on SiO2 during the fabrication of a 3D stacked ferroelectric field‐effect transistor (FeFET) memory device. The interaction between IGZO and SiO2 during CH4/Ar plasma processing was investigated using time‐of‐flight secondary ion mass spectrometry. The efficacy of removing IGZO atoms that had diffused into the SiO2 network was enhanced when subjected to plasma with a bias voltage, compared to the process without a bias voltage. However, exposure to CH4/Ar plasma resulted in a deeper diffusion of IGZO atoms into the SiO2 network, primarily attributed to ion bombardment rather than elevated surface temperature. A significant improvement in surface smoothness was achieved after IGZO and SiO2 etch by introducing BCl3 into the SiO2 etching chemistry.