Plasma enhanced CVD of fluorocarbon films by low-pressure dielectric barrier discharge

Abstract

Low-pressure dielectric barrier discharge (DBD) plasmas have been used to deposit polymerized fluorocarbon (FC) films on silicon substrates. The effects of discharge pressure and frequency of power supply on the film quality have been systematically investigated. The deposited films were characterized by scanning electron microscopy, atomic force microscopy, X-ray photoelectron spectroscopy, and static contact angle measurements. Experimental results show that FC films with a less crosslinked structure may be deposited at a relatively high pressure. Increasing the frequency of power supply leads to a significant increase in the deposition rate. All deposited FC films with a uniform microstructure show the hydrophobic property. Decreasing the frequency of power supply or increasing the deposition pressure results in the deposition of FC films with the extremely low surface roughness. The relationship between plasma parameters and the analyzed properties of deposited FC films is discussed.