Plasma deposition of a stable SiOx‐like layer on copper surface for enhanced pool boiling heat transfer performance: A combination of microstructures and wetting properties

Abstract

AbstractIn this study, a thin film composed of inorganic SiOx is deposited on the copper surface by atmospheric pressure plasma‐enhanced chemical vapor deposition. A pool boiling experiment is performed and the influence of the coating on pool boiling performance is examined. Morphology, composition, and wettability of the thin films are assessed using a scanning electron microscope, energy‐dispersive X‐ray spectrometer, and contact angle measurements. In addition to the enhancement of pool boiling thermal characteristics, especially a 103% increase in heat transfer coefficient, it is observed that the plasma‐deposited thin film on the copper surface is stable after the four boiling/cooling cycles. Finally, the underlying mechanism behind the improvements achieved by use of coated surface is studied.