Abstract
ABSTRACTExperimental results on chemical mechanical polishing of copper and tantalum in the presence of different chemicals, such as Fe(NO3)3, H2O2 and glycine, using both silica and alumina abrasive particles are presented. The polish rates with alumina slurries vary in accordance with the hardness of the material being polished, suggesting a dominant role for a wear mechanism. However, polish rates with silica slurries do not relate directly to the hardness of the film, indicating a more complex removal mechanism.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
