Planarization of 2 ̋ Sapphire Wafer Using Magnetic Abrasive Polishing Process

Abstract

In this study, the process of magnetic abrasive polishing (MAP), installed permanent magnet to improved magnetic force on surface of wafer, was used for planarization of sapphire wafer. The surface roughness and polished area were investigated according to polishing time. The results showed that the improving strategy of magnetic force was helpful to improvethe roughness of sapphire and the polished area was gradually increased according to polishing time since the frictional heat between magnetic abrasives and wafer surface caused the improvement of fluidity for magnetic abrasive. In addition to, for using medium based on oil, the better improvement of surface roughness was achieved comparing to silicone gel medium of high viscosity.