Planar-bond-all: A technology for three-dimensional integration of multiple packaging functions into advanced power modules

Abstract

A packaging approach has been developed for fabrication of power electronics modules. The multi functions of power packaging are fulfilled through three-dimensional (3-D) planar electrical interconnection, and double sided direct cooling. The further integration of these features into one packaging process has been demonstrated with highly integrated silicon (Si) and silicon carbide (SiC) phase leg power module prototypes. The comprehensive improvements in module's electrical, thermal performance and manufacturability lead to cost-effective, high efficiency, high power density power conversion in electric drive systems of modern vehicles.