Abstract
We propose a planar optical configuration for implementation of crossover interconnects. The planar overlay allows two-dimensional pixel arrays located on a wafer-scale integrated circuit to be interconnected in a compact and vibrationally robust configuration. By using an acute-angle microprism array with apex angles of 70.52 deg fabricated on a silicon substrate, we show the experimental result of the crossover interconnections. Some practical limits of the planar optical crossover interconnections are also discussed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
