Abstract
The integration of active optoelectronic devices, passive optical devices, and electronics into planar lightwave integrated circuits (PLICs) at the chip level, and planar lightwave integrated systems (PLIS) at the substrate or package level, have applications in optical interconnection, optical signal distribution and processing, and in integrated optical sensing. Heterogeneous integration of thin film devices is an effective method of creating PLICs and PLIS. Thin film InP-based edge emitters and thin film photodetectors have been integrated with polymer waveguides to create planar lightwave systems.
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