Abstract
Planar n-in-n silicon detectors with small pitches and slim edges are being investigated for the innermost layers of tracking devices for the foreseen upgrades of the LHC experiments. Sensor prototypes compatible with the CMS readout, fabricated by Sintef, were tested in the laboratory and with a 120GeV/c proton beam at the Fermilab test beam facility before and after irradiation with up to 2×1015neq/cm2 fluence. Preliminary results of the data analysis are presented.
Highlights
The CMS collaboration has an ongoing R&D plan to develop a new tracking system able to operate at and above the design luminosity of the HL-LHC [1]
Planar n-in-n silicon detectors with small pitches and slim edges are being investigated for the innermost layers of tracking devices for the foreseen upgrades of the LHC
The prototype sensors are bumpbonded to a single PSI46Digv2.1 Read Out Chip (ROC) [4]
Summary
The CMS collaboration has an ongoing R&D plan to develop a new tracking system able to operate at and above the design luminosity of the HL-LHC [1]. In particular the pixel detector will be replaced with a new one (Phase−II−Pixel) to maintain a high tracking and b-jet identification efficiency at luminosities up to 5·1034 cm−2s−1. The foreseen integrated luminosity of 3000 fb−1 together with the high particle rates demand sensors with higher granularity and a sensor design with limited dead area surrounding the active pixel array. The prototype sensors characterized in this document were fabricated by Sintef [2] in the unused area of the wafers used for the Phase-I CMS pixel upgrade production. The prototype sensors are bumpbonded to a single PSI46Digv2.1 Read Out Chip (ROC) [4]. This approach has the advantage of relying on an established production processes to test new key features for the upgraded tracking system
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