Abstract
This paper demonstrates how the PIXAPP Photonics Packaging Pilot Line uses its extensive packaging capabilities across its European partner network to design and assemble a highly integrated silicon photonic-based optical transceiver. The processes used are based on PIXAPP's open access packaging design rules or Assembly Design Kit (ADK). The transceiver was designed to have the Tx and Rx elements integrated on to a single silicon photonic chip, together with flipchip control electronics, hybrid laser and micro-optics. The transceiver used the on-chip micro-optics to enable a pluggable fiber connection, avoiding the need to bond optical fibers directly to the photonic chip. Finally, the packaged transceiver module was tested, showing 56 Gb/s loop-back modulation and de-modulation, validating both the transmitter and receiver performance.
Highlights
Recent decades have seen the growth of integrated photonics supported by the ever-growing information communication technology needs, as well as lidar systems, biomedical and other industrial sensing applications
The silicon Photonic Integrated Circuit (PIC) platform was created on the foundation of established CMOS fabrication technology for silicon electronics
A wide array of Si-photonic elements has been demonstrated, and while there continues to be improvements in component performance, the technology has matured to the stage that design kits exist
Summary
Recent decades have seen the growth of integrated photonics supported by the ever-growing information communication technology needs, as well as lidar systems, biomedical and other industrial sensing applications. The silicon Photonic Integrated Circuit (PIC) platform was created on the foundation of established CMOS (complementary metal–oxide– semiconductor) fabrication technology for silicon electronics. This native compatibility with CMOS technology, together with the ability to build compact, highly integrated photonic subsystems are the main driving forces behind Si-photonics. The field has further grown out of the Silicon to include other integrated photonics platforms such as SOI [1], [2], InP [3], Si3N4 [4] and Ge [5]. Which, at small volumes, can amount to about 50% of overall product cost
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