Abstract
The formation of pin holes in tin films condensed onto various substrate materials held at 100°K and annealed to room temperature under different vacuum conditions, was observed optically. It was found that such holes develop above 200°K and are merely the manifestation of a stage of incomplete agglomeration of the film. An evaluation of several different cleaning and substrate handling procedures in conjunction with our observations leads to the belief that pin hole formation is not triggered by surface discontinuities in this case. It is suggested instead that these pin holes are formed with the aid of heat of transformation in regions of increased defect concentration. Precipitation of defects is assumed to come about primarily during the irreversible annealing process below 150°K.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
