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Abstract
Abstract The continued miniaturization of integrated circuits (ICs), interconnects, relays, and packaging critically depends on the electrical properties of low force electrical contacts. This paper presents the design, fabrication, and characterization a micro-mechanical force sensor integrated with a four-wire electrical contact characterization capability to evaluate low force and small area electrical contacts comprised of thin films. The sensor consists of a silicon cantilever beam with a piezoresistive force sensor suitable for high-accuracy force measurements in the nanoNewton to milliNewton range. The work presented expands the characterization capabilities for the electromechanical properties of such contacts over what is currently available, using instrumented micro-electromechanical system (MEMS) force sensors. The effects of varied contact tip dimensions and different gold films manufactured using standard semiconductor processing techniques are studied. The cantilevers are evaluated for force sensitivity, range, noise and sensitivity of four-wire contact resistance measurements. The piezoresistors have a gage factor of about 35 and noise of
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