Abstract
Conventional thin-film processing techniques remain inadequate for obtaining superior dense ceramic thick films. The incompatibility of ceramic films prepared via other methods, such as screen printing, spin coating, and sputtering, is a major obstacle in the fabrication of thick film-based ceramic electronic components. The granule spray in vacuum (GSV) processes and aerosol deposition (AD) are important coating approaches for forming dense ceramic thick films featuring nanoscale crystallite structures at room temperature, which offer excellent material properties and facilitate cost-effective production. AD ceramic coatings require the acceleration of solid-state submicron ceramic particles via gas streams with a velocity of a few hundred meters per second, which are then wedged onto a substrate. This process is economical and particularly useful for the fabrication of piezoelectric thick film-based microactuators, energy harvesters, sensors, and optoelectronic devices. More recently, the GSV technique was improved to achieve more uniform and homogeneous film deposition after AD. This review article presents a detailed overview of the AD and GSV processes for piezoelectric thick films in terms of recent scientific and technological applications.
Highlights
The synthesis of dense ceramic involves high-temperature firing (≥1000 ◦ C)
Upon particles collide with the substrate mounted on the x–y stage and form a firmly adhering entering ceramic the deposition chamber, the accelerated particles collide with the substrate mounted on the x–y film
0.08–2.0 μm) in a carrier gas is accelerated to several hundreds of meters per second the particles is converted to heat energy, which increases the local surface temperature and directly impacts theadesired substrate
Summary
The synthesis of dense ceramic involves high-temperature firing (≥1000 ◦ C). The high-temperature annealing or sintering of ceramic components results in uncontrolled volatilization or decomposition. This necessitates the development of ground-breaking engineering processes for fabricating high-performance functional devices with dense films, which reduces the cost of device fabrication. Films with a thickness of 1–100 μm are primarily employed for the successful fabrication of microelectromechanical systems (MEMS), actuators, etc. There is a need to develop a novel method for processing thick films to ensure integration competence in circuits and/or miniaturized devices
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