Abstract
In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using adhesive rubber stamps mounted on a chip mounter. By using these methods, not only ultrathin microsensors but also microcontroller and amplifier chips required for the fabrication of sensor devices can be mounted. We successfully transfer-printed a very fragile 5-mm-long, 1-mm-wide, 5μm-thick high-aspect-ratio ultrathin strain sensor onto a flexible printed-circuit substrate. Then, we connected the sensor to the copper wiring by printing a conductive paste using a screen printer. Since an output voltage corresponding to the magnitude of the strain from the developed sensor was generated, it was confirmed that ultrathin sensors could be transfer-printed to the flexible substrate by this transfer technique without damage.
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