Piezoelectric micropump cooler for high-power electronic cooling

Abstract

Micro-liquid cooling is highly effective for the thermal management of electronic chips. However, it is challenging to apply to high heat flux and compact electronic devices because of the limited cooling power and large pump volume. To address this issue, a compact piezoelectric micropump cooler (PMC) integrating a parallel piezoelectric micropump (PPMP) and a heat sink with a fluid guidance structure is designed. The flow and heat transfer performance of the PMC is theoretically optimized through a numerical coupling model considering mechanics, flow-solid heat transfer, and piezoelectric effect. Simulation results suggest that a copper electrode-PZT ratio of 1.4 increases the output flow rate of the PMC, and the design of five fluid guidance structures enhances its heat dissipation effectiveness. Based on the optimized results, the PMC prototype is manufactured employing 3D printing technology. Experimental results show that the flow rate maximum is 62 mL/min with a precision of 0.07 mL/V·min. When the flow rate of PMC increases to 50 mL/min, the temperature of a heat source with 50 W/cm2 can be reduced to 57 °C, which is comparable with the simulation value. The developed model accurately characterizes the heat transfer properties of the PMC thermal management approach, providing a valuable reference for future research. The proposed PMC is characterized by its compact size, high level of integration, and exceptional cooling performance, making it suitable for electronic cooling applications with high heat flux.