Abstract

MEMS (Microelectromechanical Systems) R&D originated from the successes of microactuator device fabrication by Si semiconductor micromachining technology. Although this technology is suitable for fabricating microstructures, the sensing and actuation capability employed is limited only to electrostatic and capacitive devices, which results in the limited functions of the devices. In particular, high force output with low power dissipation cannot be achieved by electrostatic actuation. The integration of piezoelectric materials for MEMS is thus highly encouraged to realize high force output as well as sensing capability using both piezoelectric and inverse piezoelectric effects. This integration then results in simplification of the microstructures. Promising applications of piezoactuators and the difficulties of integrating exotic piezoelectric materials in conventional micromachining processes are discussed in this paper.

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