Abstract
A multilayer piezoelectric material was fabricated using piezoelectric materials with low-temperature sintering capabilities and high piezoelectric coefficients to develop a functionally superior piezoelectric speaker with a large-displacement deformation. A soft relaxor was utilized to prepare the component materials, with the optimized composition of the investigated piezoelectric ceramics represented by . was added to assist the low-temperature sintering conducted at 875 °C, which yielded a multilayer piezoelectric material with superior properties (= 500 pC N−1, = 0.63, = 44 mV N−1). A multilayer piezoelectric actuator with a single-layer thickness of ~40 µm and dimensions of 12 × 16 mm2 was fabricated by tape casting the prepared green sheets. Finite element analysis revealed that the use of a PEEK film and a smaller silicone–rubber film as a composite in the diaphragm realized optimal frequency-response characteristics; the vibrations generated by the piezoelectric element were amplified. The optimal structure obtained via simulations was applied to fabricate an actual piezoelectric speaker with dimensions of 20 × 24 × 1 mm3. The actual measurements exhibited a sound pressure level of ~75 dB and a total harmonic distortion ≤15% in the audible frequency range (250–20,000 Hz) at an applied voltage of 5.
Highlights
The demand for ceramic components with superior reliability and functionality has increased recently to keep pace with the enhanced performance of various electronic devices including smartphones, personal computers, and wearable devices
Several complex electronic components have been replaced with piezoelectric materials
An appropriate amount of an aqueous solution of 10 wt.% polyvinyl alcohol (PVA) was added to the powder as a binder, and the powder was molded into a Ø 10 mm disk by applying a pressure of approximately 10 MPa
Summary
The demand for ceramic components with superior reliability and functionality has increased recently to keep pace with the enhanced performance of various electronic devices including smartphones, personal computers, and wearable devices. Thin, and highly efficient internal electronic components are being developed to integrate numerous functions in a high-density manner within the limited dimensions of mobile technological products [1,2]. In this regard, several complex electronic components have been replaced with piezoelectric materials. A multilayer piezoelectric actuator was subsequently fabricated to realize the optimized, simulated structure by layering a Ag electrode with a small amount of Pd and a PZNN-PZT piezoelectric material Components such as the diaphragm and frame were assembled to fabricate an acoustic actuator, whose acoustic properties were evaluated according to frequency
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