PI3D processing of DLC coatings for different applications

Abstract

AbstractDLC (a ‐C:H) and Si‐DLC coatings have been deposited on various materials (steel, aluminium, silicon, glass, polymers) using a 1‐m3 interior‐antenna ICP PI3D facility with HMDSO and toluene as precursors. For conformal treatment of 3‐D workpiececs, a low‐voltage (0.5 ‐ 1) kV, high repetition rate (up to 70 kHz) pulsing was applied. However, DLC formation on dielectric substrates was performed at higher (2 ‐ 10) kV voltage using short (1 ‐ 1.5) μs pulses to minimize surface charging. Coating adhesion was achieved by formation of multi layer structure comprising Si‐containing buffer layer, transient layer, DLC layer with gradually increasing hardness, and top hard DLC. Film hardness was (5 ‐ 20) GPa, and the deposition rate (4 ‐ 0.5) μm/h. DLC surface roughness was (0.7 ‐ 60) nm and water contact angle 70° ‐ 110° depending on process parameters which implies various applications. Batch processing of sliding parts, cutting tools, glass moulds was performed. Double‐side DLC coating on polymer web eliminated its rolling up due to the coating stress. With novel ICP antenna the DLC processing is promising for large‐scale nano pattern transfer technology. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)