PI film property analysis in the application of infrared image transform technique

Abstract

Modern infrared focal plane arrays (IR FPA) with high dynamic range, and multiband versions are being deployed in fielded systems. It needs to develop advanced scene projection technology to operate both in laboratory testing for hardware-in-the-loop simulation and validation of fielded units immediately prior to mission use. One of the fiber array visible to infrared imaging transducer is introduced. Different from the fiber bundle, the fiber array is etched on the substrate material. The property of transducer is determined by the substrate material. Polyimide (PI) film has the property of high dynamic range for temperature resistant, electric insulating, radiation resistant, good thermosetting and thermomechanical effect. The heat diffusion property of PI film is analyzed by experimental study. For experimental study, samples of with sputtered graphite on surface and different thickness of PI film were made. Using the visible light irradiate on the film and a high speed infrared camera capture the temperature information. The time of raising temperature process and the max temperature were recorded. The different energy of visible light was tried for the max temperature for samples. The result show the PI film can be achieved to 600K and has high thermal efficiency. And the surface film with good absorptivity is also important for heat transforming. PI film can be used as one of the material in the Infrared imaging transducer for high dynamic range and multiband radiation.