Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems

Abstract

This study focuses on Ag die bonding failure physics and high-temperature reliability that the die back-side and substrate surface are both finished ENIG when power modules are embedded in-wheel motor systems. The thermal reliability of the Ag sintered die-bonded structures was harsh thermal aging tested for up to 500 h at 250 °C. We systematically investigated the degradation mechanism generated during the thermal endurance test at 250 °C of the die-attach structure bonded with Ag sinter at a very low temperature of 175 °C by EBSD analysis.