Abstract
Physics-based 3D simulations were conducted on a GaN high-electron-mobility transistor (HEMT) and a super-heterojunction field-effect transistor (SHJFET) to investigate the single event effect mechanism under heavy ion irradiation. Most of the single event transient current in HEMT was attributed to the punch-through effect in the bulk caused by the local increase in electrostatic potential. With improved E-field management and a more favorable potential profile to suppress source electron injection, the SHJFET had a 70% lower transient current peak value compared to the HEMT.
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