Abstract
Applying the discharge crucible (DC) method, the viscosity, density, and surface tension were determined for Sn-9Zn and Sn-2.92Ag-0.4Cu-3.07Bi (SAC + Bi) alloys. For comparison, the dilatometric, maximum bubble pressure, and capillary flow methods were used for measurements of these same physicochemical properties for the Sn-2.92Ag-0.4Cu-3.07Bi (SAC + Bi) alloy. The measurements were performed for Sn-9Zn and SAC + Bi alloys in the temperature range from 513 K to 723 K and 530 K to 1180 K, respectively. The experimental data obtained show that addition of Bi to SAC increases the density and decreases the surface tension and viscosity in comparison with SAC solder. Additionally it was found that the properties studied by different methods (maximum bubble pressure, dilatometric, capillary flow, and discharge crucible) were almost identical.
Highlights
Over the past 20 years, researchers have invested a lot of effort in identifying substitutes for lead solders, as they are harmful to the environment
The temperature dependences of density and surface tension were described by a linear relationship and the viscosity by an Arrhenius equation; they are presented in Table I along with estimated errors of the equation parameters and values calculated at the temperature of 623 K
The experimental results for the density and surface tension of Sn-9Zn alloy obtained using the discharge crucible (DC) method are presented in Figs. 1 and 2, respectively, along with literature data.[22,23]
Summary
Over the past 20 years, researchers have invested a lot of effort in identifying substitutes for lead solders, as they are harmful to the environment. It was shown that addition of up to 3 at.% Cu to the Ag-Sn eutectic steadily increased the density and viscosity of the alloy but did not significantly change the surface tension or contact angle. As shown by Jiang et al.,[18] these additives increase the mechanical properties and decrease the surface tension, wetting angle, and electrical resistance of the binary alloy. The advantage of Bi addition to the eutectic Sn-9Zn solder was shown by Suganuma and Kim,[9] who found that small Bi additions to Sn-Zn alloy decrease its melting temperature and increase its mechanical properties. The density, surface tension, and viscosity were measured using the discharge crucible (DC) method These physical property results are compared with earlier experimental data determined by other methods
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