Abstract
Physical vapor deposition of calcium fluoride (CaF2) thin films was performed via electron beam evaporation, resistive/thermal evaporation, and nonreactive radio frequency sputtering. Patterning of the resultant “usable” thin films was then also attempted in several ways, including by shadow mask deposition, liftoff, and direct chemical etching. Resistive evaporation produced the most stable films, having polycrystalline morphology with a moderately strong preference to the 331 orientation. The cleanest patterning results were obtained via a polymer/metal liftoff. The results and implications of each of the various deposition and patterning techniques are discussed.
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