Abstract
Low dielectric polyimides were synthesized from a new diamine, bis(4-aminophenyl)-1-adamantyl phosphine oxide (DAAPO) containing adamantane cage structured group in the pendant position. Thermomechanical properties were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analyzer (TMA). The thickness dependence of dielectric constant was measured using a LCR meter, and the results were compared with those of other polyimide systems reported. Variation of stress during film coating and annealing processes was analyzed using a bending beam curvature measurement system complemented with an in-situ film thickness measurement system, the interferometer. Stress was developed as solvent evaporated during film baking process, and the residual stress was obtained when the coated films were prepared. The stress behavior was significantly affected by ramping and annealing schedules.
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