Abstract
Low dielectric polyimides were synthesized from a new diamine, bis(4-aminophenyl)-1-adamantyl phosphine oxide (DAAPO) containing adamantane cage structured group in the pendant position. Thermomechanical properties were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analyzer (TMA). The thickness dependence of dielectric constant was measured using a LCR meter, and the results were compared with those of other polyimide systems reported. Variation of stress during film coating and annealing processes was analyzed using a bending beam curvature measurement system complemented with an in-situ film thickness measurement system, the interferometer. Stress was developed as solvent evaporated during film baking process, and the residual stress was obtained when the coated films were prepared. The stress behavior was significantly affected by ramping and annealing schedules.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.