Abstract
AbstractTime division SQUID multiplexing is being developed as the TES readout technology for the ATHENA X-ray integral field unit and CMB-S4. Close packing of TDM and dc-biased SQUID components is motivated by chip area constraints but has resulted in significant physical neighbor crosstalk in previous generation chips. We present techniques to reduce physical neighbor crosstalk in both linear and two dimensional (2D) TDM chips as well as measurements of crosstalk in these chips.
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