Physical metallurgy in lead-free electronic solder development

Abstract

Classical physical metallurgy principles play significant roles in the pursuit of suitable substitutes for traditional lead-based solders in the electronic industry. Phase diagrams, alloy development, solidification, diffusion, wetting, aging, precipitation of second-phase particles, microstructural coarsening, temperature effects, thermomechanical behavior, and creep are among the issues to be considered. This article focuses on the importance of physical metallurgy in these developments.