Abstract
Titania-containing polyimide (PI) hybrid films with homogeneous and flexible properties have been fabricated via sol–gel process. Various contents of titania are added to three different PI systems by using acetylacetone to reduce the reaction rate and to prohibit gelation. The thermal, electrical and mechanical properties of the hybrid films will be measured and compared to pure PI. Results indicate that the metal-containing PI possesses lower thermal expansion and resistivity than pure PI. Incorporation of small amount of titania enhances mechanical properties of the hybrid films at both low and elevated temperature. The relationship between the effect of titania concentration, structure and properties will also be discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
