Physical and bonding characteristics of N-doped hydrogenated amorphous silicon carbide films grown by PECVD and annealed by pulsed electron beam

Abstract

Nitrogen-doped amorphous silicon carbide films were grown by a plasma enhanced chemical vapour deposition (PE CVD) technique. The actual amount of nitrogen in the SiC films is determined by Rutherford backscattering spectrometry (RBS). For irradiation experiments we use electron beams with a kinetic energy 200 keV, a pulse duration of 300 ns, and a beam current of 150 A/cm2. It is found that with increased nitrogen doping and following activation of dopants the resistivity of the amorphous SiC films is substantially reduced.