Abstract
Photovoltaic and physical characteristics of screen-printed monocrystalline silicon solar cells (SPMSCs) were presented with electroplated copper (EPC) as the rear contact. The boron back surface field (B-BSF) formed by spin-on doping and laser doping (LD) was prepared as a seed layer for the EPC. The LD parameters, including the laser focus, laser power, laser speed, and laser line pitch, were investigated. Moreover, the effects of KOH etching on the surface properties after the LD process were explored. Furthermore, to enhance the adhesion between the B-BSF seed layer and EPC contact layer, a laser pinhole process was proposed. Finally, the EPC processes with various electroplating times were addressed. The results revealed that the mechanism of enhancements could be attributed to a continuous B-BSF seed layer and a reduction of series resistance, as well as an increase of open-circuit voltage and adhesion between the B-BSF seed layer and EPC contact layer.
Highlights
Screen-printed mono- and multicrystalline silicon solar cells have been extensively developed for industrial solar cells [1,2,3,4]
In this work, a boron back surface field (B-BSF) layer formed by spin-on-dopant and laser doping (LD) technology was proposed as a seed layer for the electroplated copper (EPC)
A B-BSF seed layer formed at −0.04 mm from laser focus was prepared for EPC as the rear contact of screen-printed monocrystalline silicon solar cells (SPMSCs)
Summary
Screen-printed mono- and multicrystalline silicon solar cells have been extensively developed for industrial solar cells [1,2,3,4]. A one-step annealing front metal contact process by an adapted plating stack of Ni–Cu–Ag was investigated to enhance the spectral response of silicon-based solar cells [10]. The implementation of a lightly doped emitter and plated Ni–Ag front side contacts was demonstrated to increase the conversion efficiency of silicon solar cells [12]. Improved photovoltaic characteristics for SPMSCs were demonstrated by EPC as the rear metallization. The seed layer for EPC was achieved by an Al back surface field formed by a screen-printed Al paste [13]. Investigations of a selective emitter in a single-step diffusion process for plated Ni-Cu metallization of crystalline silicon solar cells were demonstrated [15]. Improved conversion efficiency for SPMSCs will be demonstrated by EPC as the rear contact
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