Abstract
Photoresists can be classified as either positive resists or negative resists depending on their mode of interaction with light. With the exception of photomasking, the process handling considerations for these two classes are similar. Photoresist performance is highly dependent on processing techniques. Typical processing procedures are discussed along with process problems and performance limitations of currently available materials. General materials chemistry of typical photoresists is discussed, and possible photomechanisms, development mechanisms, and adhesion mechanisms are considered. Substrates to which a resist is applied introduce another variable for consideration when evaluating resist performance.
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