Abstract
Polysilsesquioxanes In article number 2214865, Insik In, Yong Jin Jeong, Se Hyun Kim, and co-workers prepare two types of UV-curable high-dielectric-constant polysilsesquioxanes by introducing epoxy-containing side chains: 1) glycidyl epoxy-containing linear groups and 2) bulky cycloaliphatic epoxy-containing groups. The structure of the side chains influenced the UV curing behavior and capacitance characteristics of polysilsesquioxanes. These polysilsesquioxanes are used to implement logic gates and memory cells exhibiting low-voltage and non-destructive operations.
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