Abstract
Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with terabit/s data rates have come into reach. However, as on-chip integration density increases, a technological breakthrough is considered indispensable to cope with the associated off-chip connectivity challenges. Here we report on the concept of photonic wire bonding, where transparent waveguide wire bonds are used to bridge the gap between nanophotonic circuits located on different chips. We demonstrate fabrication of three-dimensional freeform photonic wire bonds, and we experimentally confirm their viability for broadband low-loss coupling and multi-terabit/s data transmission.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
