Abstract
SummaryThe introduction of an interference-fit pin in a circular hole in a flat plate is found to result in a reduction in the stress concentration factor at the hole boundary under tension applied to the plate. The S.C.F. decreases rapidly with increase in the ratio of interference stress to applied tension, and decreases also with increase in the ratio of hole diameter to width of plate. Very little difference in the S.C.F. is found for different ratios of Young's modulus of pin and plate.
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