Phosphoric acid and copper (II) sulphate as a combined etchant and activator prior to the use of an anaerobic adhesive

Abstract

Objectives. Previous work has shown that steel attachments can be bonded to etched human enamel using anaerobic adhesives, following treatment with a solution of 0.05 M copper (II) sulphate. The objectives of this experiment were to determine whether simultaneous etching and activation could be performed with a combined solution of o-phosphoric acid and copper (II) sulphate. Method. Stainless steel attachments were bonded to human enamel using an anaerobic adhesive. In each case the enamel was etched and activated using a solution of 37% o-phosphoric acid containing various concentrations of copper (II) sulphate. After bench curing for one hour, the specimens were shear bond tested to failure and the load at debond recorded in each case. Following determination of the optimum copper (II) sulphate concentration the experiment was repeated, but this time the acid was made into a gel using colloidal silica. The effect of rinse time after etching was also investigated with the gel. Results. The results were analysed using mean force to debond (N) and 95% confidence intervals. Kaplan–Meier survival probabilities and log rank tests were also performed. Under the conditions of this experiment the optimum concentration of copper (II) sulphate was found to be 1 M. When the acid was made into a gel the optimum rinsing time was found to be 60 s. Significance. This experiment demonstrates that steel attachments can be bonded to enamel using anaerobic adhesives where the enamel has been simultaneously etched and activated. A combined o-phosphoric acid and copper (II) sulphate solution or gel can be used, but a conventional etch pattern is not produced.