Abstract
In this study, Cu/In/Cu sandwich structures were fabricated at 180 °C, which was followed by aging at 245 °C, 273 °C, and 290 °C for different time periods. The microstructural evolutions were investigated using scanning electron microscopy (SEM), electron backscattering diffraction (EBSD), and energy dispersive X-ray spectroscopy (EDS). The results show that the intermetallic compounds formed included Cu11In9, Cu2In, and Cu7In3, depending on the aging conditions. The activation energies for the growths of Cu2In and Cu7In3 are estimated to be 17 kJ/mol and 40 kJ/mol, respectively. The compound Cu2In tended to encircle voids, and wavy edges formed presumably due to the grain orientations of the Cu substrates. The mechanical properties of the compounds were measured by the nanoindentation test. The results show that CuIn compounds have better mechanical properties than CuSn compounds.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
