Phase Evalution in the Phosphorous-rich Layer Formation for SnAgCu/Ni-P Join

Y.C Lin,K.J Wang,J.G Duh

doi:10.1109/emap.2006.4430658

Phase Evalution in the Phosphorous-rich Layer Formation for SnAgCu/Ni-P Join

Y.C Lin, K.J Wang + Show 1 more

https://doi.org/10.1109/emap.2006.4430658

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Publication Date: Dec 1, 2006

#Under Bump Metallizations #Field Emission Electron Probe Microanalyzer + Show 8 more

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Abstract

In microelectronic package, interfacial reaction between solders and under bump metallizations (UBM) is very important in the joint reliability. In this study, interfacial morphologies and microstructure of Sn-3Ag-0.5Cu/Ni-P UBM with various phosphorous contents were investigated by field emission electron probe microanalyzer (FE-EPMA). Through contrast control technique in the BEI mode along with series of quantitative analysis phase evolution of P-rich layers was investigated. In addition, a possible formation mechanism of Ni <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> SnP layer was proposed.

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