Abstract
Hypereutectic Sn-58%wt Bi solders were synthesized to observe phase change, corrosion and electrical endurance by various thermal storages. Initially, Cu6Sn5 IMC layer thickness is linear growth by Sn reacting with Cu joint, following, the Cu3Sn IMC starts to grow when the Cu6Sn5 is thicker enough to obstruct Cu inter-diffusing into solder. The segregation of Bi concentration gradient in eutectic phase is mitigated by homogenization treatment but corrosion resistance is deteriorated. Lump shape of SnO2 corrosive byproduct is initially observed, then the flower shape of Bi3O2 is found after Sn corroding completely. Moreover, phase change of solder related with current endurance is studied.
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