Abstract

AbstractThin‐film photovoltaic technology, based on hybrid metal halide perovskites, has achieved 25.2% and 16.1% certified power conversion efficiencies for solar cell and solar module devices, respectively. Still, the gap between power conversion efficiency of small area solar cells and large area solar modules is greater than for any other photovoltaic technology. Analysis of loss mechanisms in n‐i‐p solution processed devices defined layer inhomogeneity loss and inactive area loss as the two most prominent loss mechanisms in upscaling. In this study, we focus on minimizing inactive area loss. We analyze the point contact interconnections design and demonstrate it on perovskite thin‐film solar modules to achieve a geometrical fill factor of up to 99%. Numerical and analytical simulations are utilized to optimize interconnections and solar module design and balance inactive area loss, series resistance loss, and contact resistance loss.

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