Abstract
To further promote the progress of the embedded mold packaging technology in circuit board, polymer-based composites with alternating positive and negative permittivity layer have been designed. Compared with single-layer materials, permittivity in this work is increased from 113 to 250 at 100 Hz in BFT/PVDF–Ti3SiC2/PVDF–BFT/PVDF sandwich structure, with the loss tangent’s decreasing from 0.97 to 0.78. As negative permittivity layer filler, the Ti3SiC2 with optimistic interfacial polarization is ascribed to the flake structure and contributes to improving the permittivity, resulting in good insulation behavior and temperature stability at the same time. It is expected to provide new ideas for investigating high-permittivity polymer–matrix composites in this work.
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