Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages

Abstract

This study presents an application of the peridynamic theory to investigate failure propagation in a multi-layer thin- film structure of electronic packages. A brief description of this non-local theory is presented prior to the statement of the problem. The mathematical description of the theory and its validation by considering a well-known dynamic fracture problem are discussed subsequently. Finally, the crack propagation path in a multilayer thin-film structure predicted by the peridynamic theory was compared against measurements from nanoindentation experiments.