Abstract
Our work undertaken ten years ago in order to understand the procedures used in antiquity to realize tiny solders on gold jewellery artefacts has been extended to the rediscovery, in laboratory, of possible antique recipes and their improvements for modern purposes. We are now able to put forward economical processes to solder pieces of gold at low temperatures using bulk brazing materials and diffusion bonding processes by local diffusion of cadmium or rapid diffusion of silicon along grain boundaries. The performances of PIXE and nuclear microprobes to investigate materials and solders are discussed.
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