Abstract
In this work, trade-offs between performance and reliability in CMOS RF power amplifiers at the design stage are studied. The impact of transistor sizing, amplifier class and on-chip matching network design are explored for a 130 nm technology and the implications of design decisions in transistor gate oxide reliability are discussed and projected. A strong trade-off is observed between efficiency and reliability, mainly for different on-chip output matching architectures. A comparison between two example designs is performed via SPICE simulations that include reliability models and the effects of aging on the stress conditions of each amplifier.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
