Abstract
AbstractWoven fabric composites have been used extensively as substrate materials for multilayer printed circuit boards. This paper presents a brief overview of the recent accomplishments in the modeling and characterization of woven fabric composites. Three analytical models have been developed to predict the thermo-mechanical properties of fabric composites with various weaving geometries. A three-dimensional finite element analysis has also been adopted to determine the properties of plain-weave fabric composites.Parametric studies are performed for both hybrid and non-hybrid woven fabric composites to generate data for materials selection and design. These data are presented in the form of “structure-performance maps” where the unique characteristics and relative effectiveness of various woven fabric composites can be easily assessed. The potential of tailoring a low thermal expansion coefficient substrate material through suitable materials selection, geometrical design, and fiber hybridization is also discussed.
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