Abstract
The heat sink is used to enhance heat rejection from heated surface to air. The seize and the geometry of
 the heat sink with the shape of the extended surfaces have a great influence on the heat transfer coefficient. The
 first step to get the optimal design is to predict the heat transfer by conduction in solid walls of heat sink and then
 by convection between the solid and air flow. The purpose of the present study is to predict the effectiveness of
 closely spaced parallel rectangular fin array arrangement. The electronic processor was represented by the copper
 heat sink base with thermal conductivity of 401 W/m.K. The 72 fins with the geometry above mentioned were
 exposed to heat transfer with conduction and convection along all the boundaries except the bottom from which
 heat flow toward air flow domain. Mesh generation at a specific cells, number of element and number of nodes
 were taken under temperature difference validation. The experiments were done under impinging air flow rate
 with Reynolds number ranged between 4000-16000. The flow was turbulent so the k-Ԑ turbulence model needed
 to simulate mean flow characteristics. Constant heat fluxes boundary conditions were proposed with range between
 10000-70000 kW/m2. The Results of temperature contour lines depicted a heat trend from the hot base through the
 extended surfaces to the fin tips. The fins were aligned in the core of heat sink showed higher temperature gradient
 compared with the fins existed in lines surrounded the core. The thermal resistance decreased as the Reynolds
 number increased and the Nusselt number increased as the Reynolds number increased and also when the heat flux
 increased. The Reynolds number depicted increasing as the Nusselt number increased and so the heat rejected
 from the heat sink base increased. There is a good agreement between the experimental and simulating results at
 error percentage not exceed 2%.
Highlights
Electronic components have become one of the most wide research areas since the first application with a wide variety of electric power control and heat transfer
The characteristics of impingement cooling on plate fin heat sinks like inlet widths with various airflow velocities and the geometry seize including fin spacing and fin heights influence on thermal performance in rectangular channels [1]
This was examined by [5] for a three-dimensional heat sink module design problem. They aimed to minimize the maximum temperature in the fin array and to determine the best shape of heat sink. Their heat sink module design problem was firstly justified on the optimum fin height which became higher and the optimum fin thickness became thinner than the original fin array the heat sink base thickness was increased
Summary
Electronic components have become one of the most wide research areas since the first application with a wide variety of electric power control and heat transfer. The electronic components convert electrical power, so the best thermal management led to efficient performance and boosted the optimization studies. Engineers need to select the high efficient heat sink with the best performance among a wide range sorts of heat sinks working under impinging jet from the comparison of thermal resistances of the optimized pin. The effect of the geometry dimensions, the fin's height, fin's width and the base plate thickness of the heat sink that subjected to impingement air cooling were numerically investigated by [6]. The increasing of heat transfer for various pin fin heat sinks with different inline and staggered array type with circular, elliptical and square cross sections were conducted by [13], for air flow at laminar velocities by reducing the pressure gradient and thermal resistance. MATHEMATICAL MODEL The mathematical models are simplified for characterizing the commonly engineering models released heat transfer by force convention, using the Navier-Stokes equations and energy equation
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
