Abstract

PZT8 and PZT4 are the common “hard” piezoceramic materials used in power ultrasonic transducers (e.g., welding, cutting, sonar, etc.). PZT8 is perceived as the better choice for resonant devices, primarily due to its higher mechanical quality factor Qm. PZT8 is also considered a “harder” material compared to PZT4, since it has better stability at higher preloads and drive levels. Many transducer designers never consider PZT4 for their applications, even though it has clear advantages such as higher output (i.e., higher d33). Even the perceived advantage of PZT8 regarding Qm may not be significant for most Langevin, bolted stack type transducers if the mechanical joint losses dominate. This research is a case study on the performance of identical ultrasonic transducers used for semiconductor wire bonding, assembled with either PZT8 or PZT4 materials. The main purpose of the study is to establish rule-of-thumb transducer design guidelines for the selection of PZT8 versus PZT4 materials. Several metrics are investigated such as impedance, frequency, capacitance, dielectric loss, Qm, heating, displacement gain, and electro-mechanical coupling factor. The experimental and theoretical research methods include Bode plots, thermal IR camera imaging, scanning laser vibrometry and coupled-field finite element analysis.

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